Application packaging has always demanded precision, patience, and repetition. It’s also one of the areas where AI can deliver immediate, meaningful impact.

In this edition of the AdminStudio Experts Roundtable, our experts explore how AI is reshaping the packaging lifecycle and what that means for teams managing hundreds or thousands of applications. If you’re thinking about how to scale your packaging practice in an AI-first world, this session is for you.

What you’ll learn:

  • AI-assisted PSADT upgrades and 3.x to 4.x conversions
  • App Insights for smarter, context-driven packaging decisions
  • A sneak peek at AI-powered repackaging
  • AdminStudio 2026 R2 highlights and a first look at 2026 R3
Our Expert Panelists:

Mike O'Connor
Sr. Solution Engineer

Venkat Ram Donga
Product Management Director

Amit Sharma
Vice President, AI & ML

Do you have a general or a specific question around Application Packaging? If so, our panel will be on hand to answer through our community.

If you have questions about AdminStudio, this team is obviously equipped to deliver, but the topic doesn’t need to be product related. Come join our team of experts for a conversation that will last up to one hour based on the topics you bring to the table.

Join us for our next roundtable

Can’t attend the live event? Register and we’ll send you the recording when the webinar has concluded.

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